ワイヤソーのワーク切断装置

Work cutting apparatus by wire saw

Abstract

PROBLEM TO BE SOLVED: To efficiently produce wafers with good parallelism of both cut surfaces and surface roughness in a wire saw. SOLUTION: By cutting a work W by a method in which a wire 13a is made to travel in one direction, and a grooved roller 43b on the side of a cutting outlet out of two grooved rollers 43a, 43b which support the wire 13a participating directly with cutting is slightly reciprocated in the X direction, the difference (Ga-Gb) between the thickness Ga of the inlet side of grinding particles and the thickness Gb of the outlet side is compensated. In this way, even when the wire 13a does not travel in both directions, the parallelism of both cut surfaces improves, the generation of saw marks is prevented, and a cutting time can be reduced.
(57)【要約】 【課題】 ワイヤソーにおいて、両切断面の平行度がよ く表面粗さもよいウェーハを能率よく生産できるワーク 切断装置を提供する。 【解決手段】 ワイヤ13aを一方向に走行させるとと もに、切断に直接係わるワイヤ13aを支持する2個の 溝付きローラ43a、43bのうち切断出口側の溝付き ローラ43bをX方向に往復微動させながらワークWを 切断するようにして、砥粒の入口側厚さGaに対して出 口側厚さGbが不足する分(Ga−Gb)を補うように した。 【効果】 ワイヤ13aを双方向に走行させなくても両 切断面の平行度が向上し、ソーマーク等も発生せず切断 時間も短くできる。

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Cited By (2)

    Publication numberPublication dateAssigneeTitle
    JP-2014024137-AFebruary 06, 2014Kyocera Corp, 京セラ株式会社被加工物切断方法
    KR-101014299-B1February 16, 2011주식회사 엘지실트론웨이퍼 슬라이싱 장치